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I. Description
GHF2253 is a kind of phenolic resin which can cure fast under low temperature. It is developed by reaction of BPA and epoxy resin. Pure epoxy powder coatings made of GHF2253 is characteristic of good properties of flow, anti-corrosive and mechanism. GHF2253 can react with normal epoxy resin and can cure under low temperature with great performance.
II. Technical specifications
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Specification
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Test method
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Result
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Appearance
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Visualization
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Transparent granule or powder
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Softening point
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GB/T 4507-1999
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78~85℃
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Phenolic hydroxyl equivalent
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Company Standard
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230~250 (g/eq)
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Solid content
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GB/T 1725-2008
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≥99%
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III. Application and property
Reaction ratio of GHF2253 against E-12(EEW: 800~850) is from 1:4 to 1:6. The dosage of GHF2253 varies according to the EEW of epoxy resin.
GHF2253 contains catalyst which will accelerate the curing process. Extra catalysts cab be added to adjust the reaction speed when necessary.
Due to the reaction of GHF2253 is very fast, the extruding temperature shall be well controlled and no higher than 100℃. The RM supply during the producing shall be consistent to avoid possible RM gelatinization.
GHF2253 can cure under 120℃/40~45min. Curing time can be lessened by choosing lower EEW epoxy resin. GHF2253 can also cure under 200℃/2min.
IV. Suggested formulation (160℃/5minute)
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S.N.
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RM
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Supplier
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Formula I
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Formula II
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Formula III
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Formula IV
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1
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E-12
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SSC
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228.2
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239.5
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-
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-
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2
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E-14
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HengYuan
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-
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-
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222
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234
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3
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GH2253
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SSC
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51.8
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40.5
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58.0
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46.0
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4
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GLP588
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SSC
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5
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5
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5
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5
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5
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BLC701
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SSC
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4
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4
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4
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4
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6
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Benzoin
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SSC
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2
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2
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2
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2
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7
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R-760
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SSC
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120
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120
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120
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120
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10
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BaSO4↓
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DongFeng
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89
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89
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89
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89
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Total
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500
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500
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500
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500
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Film thickness: um
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60-80
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60-80
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60-80
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60-80
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Impact(direct/reverse): kg.cm
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50
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50
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50
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50
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V. Package & Storage
Available in polyethylene-lined, multi-ply paper bags, N.W.: 25KGS/Bag.
Store in cool and dry place, Keep away from heat and fire.
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